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    Products name:

  • DENKA THERMO FILM

Product use:

Materials for transporting semiconductor components and parts

product details:

Outline

A cover tape D23:I30 with excellent sealing performance for heat-seal type embossed carrier tapes. Offers good peeling characteristics with various types of underlay material like PS (polystyrene), PC (polycarbonate), PEC (polyester), PVC (polyvinyl chloride), etc.


Characteristics

Peels off with a steady force, making it easy to adjust sealing parameters for the optimal fit.

-Various grades are available, such as products treated to prevent static electricity, etc.

-ATA grade is highly transparent, providing excellent visibility of contents, while at the same time it generates little static electricity through friction with epoxy-sealed components, thus it is an effective antistatic resource for components.