Products
Packaging materials for electronic components 
Materials for electronic industry
Synthetic plastic materials
Other industrial materials
Export Business
- Liquid type sealants
- Mold Underfill
- Various types of resin fillers
- Resin substrates
- Narrow-gap applications
Outline
In addition to EMC applications, coarse-particle cut-type are available for liquid sealants, such as underfill or potting applications. It is also available for mold underfill and resin substrates.
Characteristics
Fine cut types enable low viscosity and high content in liquid type resines, Available cut points are 30, 20 and 10 micrometer. On top of standard types, low uranium (low alpha ray) types are available for memory packages. They will be available for various applications and resins.
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