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Packaging materials for electronic components 
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- Filler for thermal interface material
- Filler for semiconductor sealants
- Powder to be laid for ceramic baking
- Abrasive grain
- Spraying material
Outline
Denka Spherical Alumina is high sphericity alumina, developed by Denka’s unique high temperature melting technologies.
Denka spherical alumina can provide high thermal conductivity and improvement of the surface hardness of the various resines or rubbers by filling them.
Low ionic impurity type is also available. This can be used in the electronic materials field where reliability is required.
Characteristics
Easily filled with high content to various types of resins/rubbers, and can also control wear in kneading machines or molds compared with irregular-shaped fillers.. The particle distribution can be adjusted according to use. (particle diameter: Submicron-70µm micrometer)
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