Products
Packaging materials for electronic components 
Materials for electronic industry
Synthetic plastic materials
Other industrial materials
Export Business
Etching process in semiconductor manufacturing equipment，parts used in bonding grain process and devices inspection，as well as in the final detection.
Outline
Insulation parts，adsorption platform, anti-heat workbench，fixing plate of test bench，positioning folder，positioning grapples，slide and so on. The main materials are alumina and zirconia.
Characteristics
- Heat resistance
- Insulation
- Wear resistance
- Thermal shock resistance
- High thermal conductivity
- Light reflection prevention
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